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In the electronics industry, embedded instrumentation refers to the integration of test and measurement instrumentation into semiconductor chips (or integrated circuit devices). Embedded instrumentation differs from embedded system, which are electronic systems or subsystems that usually comprise the control portion of a larger electronic system. Instrumentation embedded into chips (embedded instrumentation) is employed in a variety of electronic test applications, including validating and testing chips themselves, validating, testing and debugging the circuit boards where these chips are deployed, and troubleshooting systems once they have been installed in the field. A working group of the IEEE (Institute of Electrical and Electronic Engineers) that is developing a standard for accessing embedded instruments (the IEEE P1687 Internal JTAG standard) defines embedded instrumentation as follows: ''Any logic structure within a device whose purpose is Design for Test (DFT), Design-for-Debug (DFD), Design-for-Yield (DFY), Test… There exists the widespread use of embedded instrumentation (such as BIST (built-in self-test) Engines, Complex I/O Characterization and Calibration, Embedded Timing Instrumentation, etc.). ''〔(【引用サイトリンク】url=http://grouper.ieee.org/groups/1687/ )〕 == History== Dating back to as early as the 1990s, the electronics industry recognized that design validation, test and debug would be seriously impeded in the near future. Initially, the impetus behind this recognition and the subsequent development of solutions was the emergence of new semiconductor chip packages such as the ball grid array (BGA) which placed the device’s pins beneath the silicon die, making them inaccessible to physical contact with an instrument’s or a test system’s metal probes. At that time, most test instruments, such as the oscilloscope and logic analyzers in design, and in-circuit test (ICT) in volume manufacturing were external to the chips and circuit boards. They relied upon placing a probe on a chip or a circuit board to obtain test data. To overcome the disappearing access for test probes, instrumentation technology began to be embedded into semiconductors and onto printed circuit boards. In recent years, this situation has been exacerbated by increasingly high-speed serial inter-chip connections (interconnects or buses) on circuit boards as well as by even more complex chip packaging technologies like system-on-a-chip (SOC), system-in-package (SIP) and package-on-package (POP). These and other developments are making instrumentation embedded into chips a necessity for design validation, test and debug processes. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Embedded instrumentation」の詳細全文を読む スポンサード リンク
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